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INTEGRATED CIRCUITS
DATA SHEET
UMA1021M Low-voltage frequency synthesizer for radio telephones
Product specification Supersedes data of 1996 Aug 28 File under Integrated Circuits, IC17 1999 Jun 17
Philips Semiconductors
Product specification
Low-voltage frequency synthesizer for radio telephones
FEATURES * Low phase noise * Low current from 3 V supply * Fully programmable main divider * 3-line serial interface bus * Independent fully programmable reference divider, driven from external crystal oscillator * Dual charge pump outputs * Hard and soft power-down control. APPLICATIONS * 900 MHz and 2 GHz mobile telephones * Portable battery-powered radio equipment. GENERAL DESCRIPTION The UMA1021M BICMOS device integrates a prescaler, programmable dividers, and a phase comparator to implement a phase-locked loop. QUICK REFERENCE DATA SYMBOL VDD VCC IDD + ICC fRF fxtal fPC Tamb PARAMETER digital supply voltage charge-pump supply voltage supply current RF input frequency crystal reference input frequency phase comparator frequency operating ambient temperature CONDITIONS VDD1 = VDD2; VCC VDD VCC VDD MIN. 2.7 2.7 - - 300 3 - -30 - - 10 5 - - 200 - TYP.
UMA1021M
The device is designed to operate from 3 NiCd cells, in pocket phones, with low current and nominal 3 V supplies. The synthesizer operates at RF input frequencies up to 2.2 GHz, with a fully programmable reference divider. All divider ratios are supplied via a 3-wire serial programming bus. Separate power and ground pins are provided to the analog (charge-pump) and digital circuits. The ground leads should be externally short-circuited to prevent large currents flowing across the die and thus causing damage. VDD1 and VDD2 must also be at the same potential (VDD). VCC must be equal to or greater than VDD (e.g. VDD = 3 V and VCC = 5 V for wider VCO control voltage range). The phase detector has two charge-pump outputs, CP and CPF, the latter of which is enabled directly at pin FAST. This permits the design of adaptive loops. The charge pump currents (phase detector gain) are fixed by an external resistance at pin ISET and via the serial interface. Only a passive loop filter is necessary; the charge pumps function within a wide voltage compliance range to improve the overall system performance.
MAX. 5.5 5.5 - - 2200 35 - +85
UNIT V V mA A MHz MHz kHz C
ICC(pd) + IDD(pd) total supply current in power-down mode
ORDERING INFORMATION TYPE NUMBER UMA1021M PACKAGE NAME SSOP20 DESCRIPTION plastic shrink small outline package; 20 leads; body width 4.4 mm VERSION SOT266-1
1999 Jun 17
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Philips Semiconductors
Product specification
Low-voltage frequency synthesizer for radio telephones
BLOCK DIAGRAM
UMA1021M
handbook, full pagewidth
VDD1 14
VDD2 4
VCC 18
FAST
1 2
UMA1021M
CPF FAST CHARGE PUMP BAND GAP 3 CP CHARGE PUMP 19 ISET
PHASE COMPARATOR
20 LOCK
6 RFI
MAIN DIVIDER WITH PRESCALER
16 REFERENCE DIVIDER 15
XTALA XTALB
POL PON
8 9 SERIAL INTERFACE
13 12 11
E DATA CLK
10 VSS1
7 VSS2
5 VSS3
17
MBG366
GND(CP)
Fig.1 Block diagram.
1999 Jun 17
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Philips Semiconductors
Product specification
Low-voltage frequency synthesizer for radio telephones
PINNING SYMBOL FAST CPF CP VDD2 VSS3 RFI VSS2 POL PIN 1 2 3 4 5 6 7 8 DESCRIPTION enable input for fast charge-pump output CPF fast charge-pump output normal charge-pump output power supply 2 ground 3 2 GHz main divider input ground 2 digital input to select polarity of power-on inputs (PON and sPON): POL = 0 for active LOW and POL = 1 for active HIGH power-on input ground 1 programming bus clock input programming bus data input programming bus enable input power supply 1 complementary crystal frequency input from TCXO; if not used should be decoupled to ground crystal frequency input from TCXO; if not used should be decoupled to ground ground for charge-pump supply for charge-pump external resistor from this pin to ground sets the charge-pump currents out-of-lock detector output Reference divider
handbook, halfpage
UMA1021M
FAST CPF CP VDD2 VSS3 RFI VSS2 POL PON
1 2 3 4 5
20 LOCK 19 ISET 18 VCC 17 GND(CP) 16 XTALA
PON VSS1 CLK DATA E VDD1 XTALB
9 10 11 12 13 14 15
UMA1021M
6 7 8 9 15 XTALB 14 VDD1 13 E 12 DATA 11 CLK
MBG365
VSS1 10
XTALA
16
GND(CP) VCC ISET
17 18 19
Fig.2 Pin configuration.
LOCK
20
FUNCTIONAL DESCRIPTION Main divider The main divider is clocked at pin RFI by the RF signal which is AC-coupled from an external VCO. The divider operates with signal levels from 50 to 225 mV (RMS), and at frequencies from 300 MHz to 2.2 GHz. It consists of a fully programmable bipolar prescaler followed by a CMOS counter. Any divide ratios from 512 to 131071 inclusive can be programmed.
The reference divider is clocked by the differential signal between pins XTALA and XTALB. If only one of these inputs is used, the other should be decoupled to ground. The applied input signal(s) should be AC-coupled. The circuit operates with levels from 50 up to 500 mV (RMS) and at frequencies from 3 to 35 MHz. Any divide ratios from 8 to 2047 inclusive can be programmed.
1999 Jun 17
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Philips Semiconductors
Product specification
Low-voltage frequency synthesizer for radio telephones
Phase detector The phase detector is driven by the output edges of the main and reference dividers. It produces current pulses at pins CP and CPF whose amplitudes are programmed. The pulse duration is equal to the difference in time of arrival of the edges from the two dividers. If the main divider edge arrives first, CP and CPF sink current. If the reference divider edge arrives first, CP and CPF source current. The currents at CP and CPF are programmed via the serial bus as multiples of a reference current set by an external resistor connected between pin ISET and VSS (see Table 3). CP remains active except in power-down. CPF is enabled via input pin FAST which is synchronized with respect to the phase detector to prevent output current pulses being interrupted. By appropriate connection to the loop filter, dual bandwidth loops can be designed; short time constant during frequency switching (FAST mode) to speed-up channel changes, and low bandwidth in the settled state to improve noise and breakthrough levels. Additional circuitry is included to ensure that the gain of the phase detector remains linear even for small phase errors. Out-of-lock detector The out-of-lock detector is enabled (disabled) via the serial interface by setting bit OOL HIGH (LOW). An open drain transistor drives the output pin LOCK (pin 20). It is recommended that the pull-up resistor from this pin to VDD is chosen to be of sufficient value to keep the sink current in the LOW state to below 400 A. When the out-of-lock detector is enabled, LOCK is HIGH if the error at the phase detector input is less than approximately 25 ns, otherwise LOCK is LOW. If the out-of-lock detector is disabled, LOCK remains HIGH. Serial programming bus A simple 3-line unidirectional serial bus is used to program the circuit. The 3 lines are DATA, clock (CLK) and enable (E). The data sent to the device is loaded in bursts framed by E. Programming clock edges and their appropriate data bits are ignored until E goes active LOW. The programmed information is loaded into the addressed latch when E returns HIGH.
UMA1021M
During normal operation, E should be kept HIGH. Only the last 21 bits serially clocked into the device are retained within the programming register. Additional leading bits are ignored, and no check is made on the number of clock pulses. The fully static CMOS design uses virtually no current when the bus is inactive. It can always capture new programmed data even during power-down. When the synthesizer is powered-on, the presence of a TCXO signal at the reference divider input and a VCO signal at the main divider input is required for correct programming. Data format The leading bits (dt16 to dt0) make up the data field, while the trailing four bits (ad3 to ad0) are the address field. The UMA1021M uses 4 of the 16 available addresses. These are chosen for compatibility with other Philips Semiconductors radio telephone ICs. The data format is shown in Table 1. The first bit entered is dt16, the last bit is ad0. For the divider ratios, the first bits entered (PM16 and PR10) are the most significant (MSB). The trailing address bits are decoded on the rising edge of E. This produces an internal load pulse to store the data in the addressed latch. To avoid erroneous divider ratios, the load pulse is not allowed during data reads by the frequency dividers. This condition is guaranteed by respecting a minimum E pulse width after data transfer. The test register (address 0000) does not normally need to be programmed. However if it is programmed, all bits in the data field should be set to logic 0. Power-down mode The synthesizer is on when both the input signals PON and the programmed bit sPON are active. The `active' level for these two signals is chosen at pin POL (see Table 2). When turned on, the dividers and phase detector are synchronized to avoid random phase errors. When turned off, the phase detector is synchronized to avoid interrupting charge-pump pulses. For synchronisation functions to work correctly on power-up or power-down (using either hardware or software programming), the presence of TCXO and VCO signals is required to drive the appropriate divider inputs. The UMA1021M has a very low current consumption in the power-down mode.
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1999 Jun 17 6
Philips Semiconductors
Table 1
Bit allocation; note 1
Low-voltage frequency synthesizer for radio telephones
FIRST IN
REGISTER BIT ALLOCATION DATA FIELD
LAST IN ADDRESS
dt16 X PM16(4) X Notes
dt15 dt14 dt13 X X X X X X
dt12 OOL(3) X
dt11 X X
dt10 CR1 PR10(4)
dt9 CR0
dt8 dt7 X X
dt6 sPON(3)
dt5 dt4 dt3 dt2 dt1 X X X X X
dt0 X PM0 PR0
ad3 0 0 0 0
ad2 0 0 1 1
ad1 0 0 0 0
ad0 0 1 0 1
Test bits(2) main divider coefficient reference divider coefficient
1. X = don't care. 2. The test register (address 0000) should not be programmed with any other values except all zeros for normal operation. 3. Bit sPON = software power-up for synthesizer (see Table 2); OOL = Out-Of-Lock (1 = enabled). 4. PM16 is the MSB of the main divider coefficient; PR10 is the MSB of the reference divider coefficient. Table 2 Power-on programming POL 0 0 0 1 1 1 Table 3 PON 0 1 X 0 X 1 sPON 0 X 1 X 0 1 SYNTHESIZER STATE on off off off off on COMPATIBILITY UMA1019M/UMA1019AM UMA1019M/UMA1019AM UMA1019M/UMA1019AM UMA1017M UMA1017M UMA1017M
Fast and normal charge pumps current ratio (note 1) CR1 0 0 1 1 CR0 0 1 0 1 ICP 2 x ISET 2 x ISET 1 x ISET 1 x ISET ICPF 8 x ISET 16 x ISET 12 x ISET 16 x ISET ICPF : ICP 4:1 8:1 12 : 1 16 : 1 Product specification
UMA1021M
Note
V SET 1. ISET = ------------- ; reference current for charge pumps. R SET
Philips Semiconductors
Product specification
Low-voltage frequency synthesizer for radio telephones
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD VCC VCC - VDD Vn VGND Ptot Tstg Tamb Tj(max) HANDLING digital supply voltage charge-pump supply voltage difference in voltage between VCC and VDD voltage at pins 6, 8, 9 and 11 to 13 voltage at pins 1, 2, 3, 15, 16, 19 and 20 difference in voltage between any of GND(CP), VSS1, VSS2, and VSS3 (these pins should be connected together) total power dissipation storage temperature operating ambient temperature maximum junction temperature PARAMETER MIN. -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 - -55 -30 -
UMA1021M
MAX. +5.5 +5.5 +5.5 VDD + 0.3 VCC + 0.3 +0.3 150 +125 +85 150 V V V V V V
UNIT
mW C C C
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices. This device meets class 2 ESD test requirements [Human Body Model (HBM)], in accordance with "MIL STD 883C - method 3015". THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient in free air VALUE 120 UNIT K/W
1999 Jun 17
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Philips Semiconductors
Product specification
Low-voltage frequency synthesizer for radio telephones
UMA1021M
CHARACTERISTICS All values refer to the typical measurement circuit of Fig.5; VDD1 = VDD2 = 2.7 to 5.5 V; VCC = 2.7 to 5.5 V; Tamb = 25 C; unless otherwise specified. Characteristics for which only a typical value is given are not tested. SYMBOL PARAMETER CONDITIONS VDD1 = VDD2; VCC VDD VCC VDD VDD = 5.5 V VCC = 5.5 V; RSET = 5.6 k logic levels 0 V or VDD MIN. - - 7 3 5 TYP. MAX. UNIT
Supply; pins 4, 14 and 18 VDD VCC IDD1 + IDD2 ICC digital supply voltage charge pump supply voltage synthesizer digital supply current charge pump supply current 2.7 2.7 - - - 5.5 5.5 9.5 3.8 50 V V mA mA A
ICC(pd) + IDD(pd) total supply current in power-down mode RF main divider input; pin 6 fRF VRF(rms) Rm Zi Ci RF input frequency AC-coupled input signal level (RMS value) main divider ratio input impedance (real part) typical pin input capacitance
300 Rs = 50 50 512 fRF = 1 GHz fRF = 2 GHz fRF = 1 GHz fRF = 2 GHz - - - -
- - - 1 60 1 1 - -
2200 225 131071 - - - -
MHz mV
k pF pF
Synthesizer reference divider input; pins 15 and 16 fxtal Vxtal(rms) crystal reference input frequency sinusoidal input signal level between pins 15 and 16 (RMS value) reference division ratio input impedance (real part) typical pin input capacitance maximum loop comparison frequency fxtal = 13 MHz fxtal = 13 MHz 3 50 35 500 MHz mV
Rref Zi Ci Phase detector fPCmax
8 - - - 10 1.5 2000
2047 - - - k pF kHz
Charge pump current setting resistor input; pin 19 RSET VSET external resistor connected between pin 19 and ground regulated voltage at pin 19 RSET = 5.6 k 5.6 - - 1.2 12 - k V
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Philips Semiconductors
Product specification
Low-voltage frequency synthesizer for radio telephones
SYMBOL PARAMETER CONDITIONS MIN. -25 - VCP/CPF =
1 2VCC
UMA1021M
TYP. - 5 1 - -88
MAX.
UNIT
Charge pump outputs; pins 2 and 3; RSET = 5.6 k Iocp(err) Imatch ILIcp VCP/CPF Phase noise N900 synthesizer's contribution to close-in phase noise of 900 MHz RF signal at 1 kHz offset (GSM) synthesizer's contribution to close-in phase noise of 1.8 GHz RF signal at 1 kHz offset (DCS1800) fxtal = 13 MHz; Vxtal = 0 dBm; fPC = 200 kHz fxtal = 13 MHz; Vxtal = 0 dBm; fPC = 200 kHz - -
dBc/Hz
charge pump output current error sink-to-source current matching charge pump off leakage current charge pump voltage compliance
+25 - +5
% % nA
-5 0.4
VCC - 0.4 V
N1800
-
-82
-
dBc/Hz
Interface logic input signal levels; pins 8, 9, 11, 12 and 13 VIH VIL Ibias Ci VIH VIL Ibias Ci VOL tOOL HIGH level input voltage LOW level input voltage input bias current input capacitance logic 1 or logic 0 0.7VDD -0.3 -5 - - - - 2 - - - 2 - 25 VDD + 0.3 V 0.3VDD +5 - V A pF
Interface logic input signal levels; pin 1 HIGH level input voltage LOW level input voltage input bias current input capacitance logic 1 or logic 0 0.7VCC -0.3 -5 - - - VCC + 0.3 V 0.3VCC +5 - V A pF
Lock detect output signal; pin 20; open-drain output LOW level output voltage phase error threshold for out-of-lock detector Isink < 0.4 mA 0.4 - V ns
1999 Jun 17
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Philips Semiconductors
Product specification
Low-voltage frequency synthesizer for radio telephones
SERIAL BUS TIMING CHARACTERISTICS VDD = VCC = 3 V; Tamb = 25 C; unless otherwise specified. SYMBOL Serial programming clock; CLK tr tf Tcy tSTART tEND tW(min) tSU;E tSU;DAT tHD;DAT Note input rise time input fall time clock period - - 100 10 10 - - - - - - - PARAMETER MIN. TYP.
UMA1021M
MAX.
UNIT
40 40 - - - - - - -
ns ns ns
Enable programming; E delay to rising clock edge delay from last falling clock edge minimum inactive pulse width enable set-up time to next clock edge 40 -20 4000(1) 20 ns ns ns ns
Register serial input data; DATA input data to clock set-up time input data to clock hold time 20 20 ns ns
1. The minimum pulse width (tW(min)) can be smaller than 4 s provided all the following conditions are fulfilled: 447 a) Main divider input frequency f RF > ------------------ . t W ( min ) 3 b) Reference divider input frequency f xtal > ------------------ . t W ( min )
tSU;DAT handbook, full pagewidth
tHD;DAT
Tcy
tf
tr
tEND tSU;E
CLK
DATA
MSB
LSB
ADDRESS
E tSTART
MGD565
tW(min)
Fig.3 Serial bus timing diagram.
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Philips Semiconductors
Product specification
Low-voltage frequency synthesizer for radio telephones
APPLICATION INFORMATION
UMA1021M
handbook, full pagewidth
power amplifier
transmit data SPLITTER transmit mixer
PLL VCO LPF
MAIN DIVIDER duplex filter TCXO PHASE COMPARATOR REFERENCE DIVIDER
UMA1021M
low noise amplifier to demodulation 1st mixer 2nd mixer
MBG369
Fig.4 Typical application block diagram.
1999 Jun 17
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Philips Semiconductors
Product specification
Low-voltage frequency synthesizer for radio telephones
UMA1021M
handbook, full pagewidth
positive supply 1
(1)
positive supply 20 19 18 100 nF 4 17 1 nF 5 16 100 nF VCC VTCXO GND Vcont fosc 5.6 k 12 12 12
12
2 100 nF
(1) (1) (1) (1)
12 100 nF
3
control RF VCO out 1 nF 18 1 nF 18 18
1 nF 56
UMA1021M
6 7 15 14 13 12 11
1 nF
positive supply
8 9
100 nF
to 1st mixer 10 1 k 1 k 1 k
MBG367
3-wire bus
(1) Values depend on application.
Fig.5 Typical test and application diagram.
1999 Jun 17
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Philips Semiconductors
Product specification
Low-voltage frequency synthesizer for radio telephones
PACKAGE OUTLINE SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
UMA1021M
SOT266-1
D
E
A X
c y HE vM A
Z
20
11
Q A2 pin 1 index A1 (A 3) Lp L A
1
e bp
10
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.5 A1 0.15 0 A2 1.4 1.2 A3 0.25 bp 0.32 0.20 c 0.20 0.13 D (1) 6.6 6.4 E (1) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.45 Q 0.65 0.45 v 0.2 w 0.13 y 0.1 Z (1) 0.48 0.18 10 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT266-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 90-04-05 95-02-25
1999 Jun 17
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Philips Semiconductors
Product specification
Low-voltage frequency synthesizer for radio telephones
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
UMA1021M
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Jun 17
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Philips Semiconductors
Product specification
Low-voltage frequency synthesizer for radio telephones
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not suitable(2) suitable not recommended(3)(4) not recommended(5) suitable suitable suitable suitable suitable
UMA1021M
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1999 Jun 17
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Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 02 67 52 2531, Fax. +39 02 67 52 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 66
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
465008/04/pp16
Date of release: 1999 Jun 17
Document order number:
9397 750 06106

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